We still have a few months to go before Qualcomm officially unveils the Snapdragon 8 Elite 2 and MediaTek’s next-generation Dimensity 9500. However, that hasn’t stopped the leaks from surfacing, and we’re keeping a close eye on them.
The latest information comes from the reliable Chinese tipster, Digital Chat Station, who has shared an AnTuTu benchmark score for MediaTek’s upcoming chip.
According to this leak, the Dimensity 9500 has achieved a score exceeding 400,000 points in its latest benchmark test. This puts it approximately 17% ahead of the highest score recorded for the Snapdragon 8 Elite so far.
Of course, since the launch is still some time away, these figures are likely to change as final optimizations are implemented.
DCS also mentions that MediaTek plans to increase the L3 cache on the 9500 from 12MB to 16MB. This enhancement should help minimize memory latency and improve app switching speed, leading to a more seamless multitasking experience.
Beyond this…
If you’re curious about the future of silicon beyond this chip, DCS notes that the next-generation processors from Apple, Qualcomm, and MediaTek will all be manufactured using TSMC’s 2nm process.
Specifically, we’re referring to the anticipated Apple A20, Snapdragon 8 Elite 3, and Dimensity 9600. The shift to a smaller fabrication process typically results in better power efficiency and performance.
However, producing SoCs on this smaller node is also more expensive, and DCS suggests that flagship phones in 2026 may see a price increase.
As for the Dimensity 9500, it is expected to be produced on TSMC’s 3nm N3E node. The chip is rumored to include two Cortex-X930 “Travis” cores and six Cortex-A730 “Gelas” cores, with the primary cores reaching speeds of up to 4GHz, representing a 10% improvement over the Dimensity 9400.
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