At its 15th Anniversary Launch Conference, Xiaomi revealed its first homegrown flagship processor, the XRING O1. This marks the company’s entry into the high-performance system-on-chip market. The new chip already outperforms Apple’s A18 Pro in some areas.
Built on 3nm Technology
Made with TSMC’s advanced 3nm process, the XRING O1 contains 19 billion transistors on a 109mm² die. It is among the most sophisticated mobile chips available today. Xiaomi founder Lei Jun said that this processor ranks in the top tier of global flagship chips.
The chip uses a 10-core quad-cluster architecture, consisting of:
- 2 ultra-large cores (up to 3.9 GHz)
- 4 performance cores
- 2 energy-efficient cores
- 2 ultra-efficient cores
According to benchmark data shared by Xiaomi, the XRING O1 achieved an AnTuTu score exceeding 3 million, with single-core scores over 3,000 and multi-core performance surpassing 9,500.
Beats Apple’s Chip in GPU and Power Efficiency
In terms of graphics, the XRING O1 includes the Immortalis-G925 GPU with 16 cores. It also supports dynamic performance adjustments. Xiaomi claims the chip uses less power and offers better graphics than the Apple A18 Pro, especially during long tasks.
This new processor can power not only smartphones but also devices for AR, VR, and wearables. Xiaomi is working to expand in these areas.
Building its chips allows Xiaomi to tune its hardware and software combo better. It also reduces reliance on outside chipmakers. Many big phone brands are now making custom chips to improve performance, efficiency, and innovation.
Broader Product Integration Ahead
The company didn’t say which upcoming device will feature the XRING O1. Still, it will appear in future flagship phones and smart gadgets. The announcement came along with new phones, wearables, and electric vehicles.
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