Samsung plans to release the Galaxy S25 FE in late 2025. The company initially intended to use its own Exynos 2400e chip. However, a recent report from Notebookcheck suggests that production problems could cause Samsung to switch to MediaTek’s Dimensity 9400 instead. The Dimensity 9400, made by TSMC, performs better than the Exynos 2400e. Still, using it might raise costs, making the Exynos chip a cheaper choice. Keeping the Exynos helps Samsung keep more revenue in-house. This might be why Samsung favors it. Yet, the higher performance of the Dimensity 9400 could make the Galaxy S25 FE more appealing. The current model, the Galaxy S24 FE, also uses the Exynos 2400e.
The Dimensity 9400 was released in October 2024. It is MediaTek’s top-tier chip, built with a second-generation All Big Core design. It features one Arm Cortex-X925 core running over 3.62GHz, three Cortex-X4 cores, and four Cortex-A720 cores. It offers 35% faster single-core and 28% faster multi-core speeds compared to the Dimensity 9300. The chip uses TSMC’s 3nm process, making it up to 40% more power-efficient and helping extend battery life.
Samsung has used MediaTek chips before in its high-end devices. The Galaxy Tab S10+ and S10 Ultra, launched last September, both used the Dimensity 9300+ chip.
Development of software for the Galaxy S25 FE has started. The US version is identified as model number SM-S731U. It is expected to run One UI 8 based on Android 16. Samsung usually releases FE models in the fall, from September to November 2025.
More details about the Galaxy S25 FE are likely to surface as the launch date nears. This will give a clearer picture of what Samsung plans for this new device.
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